Selasa, 04 Juni 2013

[Pusat Informasi Beasiswa] International Student Scholarship at Bond University in Australia

Pusat Informasi Beasiswa has posted a new item, 'International Student
Scholarship at Bond University in Australia'

The International Student Scholarships are a testament to Bond
Universitys commitment to quality and outstanding international
students. These scholarships are available to international students who
have demonstrated outstanding academic ability (academic merit based

International Student Scholarship application closing dates for each semester
are highlighted below:

Scholarship Application Closing Date
Winners Announced

September 2013
May 31, 2013
End of June 2013

January 2014
September 20, 2013
End of October 2013

May 2014
January 24, 2014

September 2014
May 30, 2014
End of June 2014


25% to 50%of tuition fees of any
undergraduate or postgraduate degree (excluding Bond University's
Medical Program, Master of Psychology, Doctor of Physiotherapy)


10 x 25% scholarships annually
10 x 50% scholarships annually


Available for international students only, for undergraduate or postgraduate
Applicants must currently be or have previously been in the top 5% of their high
school or university class.
will be selected for scholarships based on outstanding academic
ability. In addition, demonstrated strong leadership skills and
extensive involvement in extracurricular activities will also be
Students whose first language is not English must refer to and meet Bond
Universitys standard. English entry requirements for undergraduate applicants.

English entry requirements for postgraduate applicants.

Selection Criteria

Successful applicants will be awarded these scholarships based on their ability
to meet the eligibility criteria outlined

Application Submission

All international students who have made an
application to study at Bond University (by the scholarship closing date
for each semester) will be considered for an International Student
Scholarship. It is recommended that when students complete a Bond University
Application Form,
they submit a personal statement (outlining why you should be awarded a
Bond scholarship), references, resume and certified copies of other
relevant documentation to assist in supporting your application.
As part of the selection process, all shortlisted applicants will be required to
participate in a telephone interview.
for each intake of scholarship students are assessed based on academic
merit. Should your submission not be successful at the time of
application, your details will be reassessed for future semester intakes
up until the point of acceptance.
Please note: Only short-listed
applicants will be contacted for an interview. If you are not contacted
for an interview by the dates stated in the general information above,
then you can assume you have been unsuccessful in your application.
Students will not be notified of their unsuccessful application in


For further information, please contact:Maria HandScholarship CoordinatorPhone:
+61 7 5595 1028Email:

For more information, please visit the official website at

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Best regards,
Pusat Informasi Beasiswa

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